1

基材

Base material

FR-4 | High Tg | Halogen-Free | PTEE | Ceramic PCB | Polyimide

2

印制板类型

PCB type

PCB | FPC | R-FPC | HDI

3

最高层次

Max layer count

64层

64 layer

4

最小基铜厚

Min base copper thickness

1/3 OZ (12um)

5

最大完成铜厚

Max finished copper thickness

30 OZ

6

最小线宽/间距

Min trace width/spacing

内层

Inner layer

2/2mil (H/H OZ base copper)

7

外层

Outer layer

2.5/2.5mil (H/H OZ base copper)

8

孔到内层导体最小间距

Min spacing between hole to inner layer conductor

6mil

9

孔到外层导体最小间距

Min spacing between hole to outer layer conductor

6mil

10

最小过孔焊环

Min annular ring for via

3mil

11

最小元件孔焊环

Min annular ring for component hole

5mil

12

最小BGA焊盘

Min BGA diameter

8mil

13

最小BGA Pitch

Min BGA pitch

0.4mm

14

最小成品孔径

Min hole size

0.15mm(CNC) | 0.1mm(Laser)

15

最大板厚孔径比

Max aspect ratios

20:1

16

最小阻焊桥宽

Min soldermask bridge width

3mil

17

阻焊/线路加工方式

Soldermask/circuit processing method

菲林 | 激光直接成像

Film | LDI

18

最小绝缘层厚

Min thickness for insulating layer

2mil

19

HDI及特种板

HDI & special type PCB

HDI(1-3 steps) | R-FPC(2-16 layers) | High frequency mix-pressing(2-14 layers) | Buried capacitance & resistance ......

20

表面处理类型

Surface treatment type

化学沉金 | 有铅/无铅喷锡 | OSP | 沉锡 | 沉银 | 镀厚金 | 镀银

ENIG | HAL | HAL lead free | OSP | Immersion Sn | Immersion silver | Plating hard gold | Plating silver

21

最大加工尺寸

Max PCB size

609*889mm